Features :
》Good thermal conductive : 1.5-6.2W/mK:
》Naturally tacky needing no further adhesive coating :
》Soft and Compressible for low stress applications:
》Available in varies thickness （0.254-5.08mm）

Applications:
》Cooling components to the chassis of frame 
》High speed mass storage drives
》RDRAM memory modules
》Micro heat pipe thermal solutions
》Automotive engine control units
》Telecommunication hardware
》Handheld portable electronics
》Semiconductor automated test equipment (ATE)