Features :
》0.009-0.15℃-in²/W thermal resistance
》One component paste like interface material, never dry.
》Thermal compound formulated to maximize the heat transfer.
》Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures.
》Non-toxic and environmentally safe

Applications:
》Semiconductor cases and heat sinks.
》Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices.
》High capacity of CPU's and GPU's.
》Automatic dispensing and screen-printing.