Material Applications ：
It can be used in applications where no requirement for electric
insulation is specified. The unique grain orientation and plate
Structure enable these products to adapt to different contact surfaces
closely,and the maximized heat conduction function is attained

Features:
》High thermal conductive: 6.0-16.0W/mK
》Low thermal resistance

Applications:
》Power conversion equipment
》Power supplies
》Large telecommunications switching hardware
》Notebook computers